The UTCA-6302 is a MicroTCA system preconfigured with one or two MCHs, two or four power supplies, and up to twelve full-size AMCs for optimal cooling in just a 3U to 5U form factor. The system introduces an innovative front-to-rear cooling scheme and advanced redundant -48V DC power design. The system is ideal for high performance computing and for application service providers where blade density is important. Telecom equipment manufacturers and network equipment providers will benefit from the performance, cost and reliability gains which the platform offers. When equipped with Advantech's Dual Core Processor AMCs, the system provides exceptional levels of scalability for software designed hardware functions such as radio or host media processing. They provide the building blocks for unprecedented levels of reliability, performance and power savings. The MIC-5602Rev2 PrAMCs loaded in the system support Intel® Core™2 Duo processors, 45 nm Low Voltage with up to 4 GB memory.The chassis is cooled by four hot-swappable fans providing redundant cooling while four rear -48V DC power supplies provide true 600W redundancy. By extending the depth of the chassis and moving the power modules to the rear, all the front-side slots are available for the AMC payload needs and the entire system fits in a 3U height envelope for bottom-to-top cooling. For front-to-rear cooling needs, the system comes with unique top and bottom angled air-duct designs allowing 4U lossless stacking between adjacent systems in a rack.The backplane design combines dual star Gigabit Ethernet packet switching along with local PCI Express and SATA connectivity, supporting high density clustering and expansion technologies in a cost efficient design.